Check with seller Flip Chip CSP Substrate: Efficiency, Reliability, and Application Shenzhen
- Location: Shenzhen, Shenzhen, Guangdong, China
This implies that the I/O cushions can be set at any part of the outer layer of the chip and subsequently the chip size can be diminished with a fitting hardware way. This is credited to the way that the shortfall of a holding wire adds to the minimization of transmission inductance.
Contact info:- https://efpcb.wordpress.com/2024/09/25/flip-chip-csp-substrate-efficiency-reliability-and-application/
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