Check with seller BGA Assembly Quality Is Determined By Many Factors Shenzhen
- Location: Shenzhen, Shenzhen, Guangdong, China
Along with the rapid growth of extremely large-scale integrated circuits (ICs), existing package types can never meet electronics assembly demands, and fresh packages emerge as a result of increased demand for greater integrity, lower board space, and larger I/O count. Among all of the newer forms of packages, the BGA (ball grid array) package is the major type with the broadest application areas because of its variety, which overcomes many constraints seen in older packages. In terms of soldering technology, the BGA assembly is quite similar to previous packages.
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